Summary
Revenue :
000,000 M USD
Finance :
000,000 M USD
Earning Cap :
000,000 M USD
Invest :
000,000 M USD
R & D :
0000 People
Growth :
00% AGR
DIGDAL CAP
Overview
General Introduction | Tongfu Microelectronics Co., Ltd. (securities code: 002156) is an integrated circuit packaging and testing service provider. It is a Chinese integrated circuit packaging and testing enterprise that provides one-stop services for design simulation and packaging testing to global customers. The products, technology, and services of Tongfu Microelectronics cover various fields such as network communication, mobile terminals, household appliances, artificial intelligence, and automotive electronics. Tongfu Microelectronics is headquartered in Nantong, Jiangsu, with a global manufacturing and service base. It has seven major production bases in Nantong, Hefei, Xiamen, Suzhou, and Penang, Malaysia, providing fast and convenient services to global customers. It has over 18000 employees worldwide. Tongfu Microelectronics will work hand in hand with customers, with the support of national policies and market forces, driven by the demand of system manufacturers, coordinated development of the industrial chain, and support from national industrial funds, to continuously move towards the goal of becoming an international level integrated circuit testing enterprise. |
Headquarter | Nantong |
Establish Date | 2/4/1994 |
Listed Code | 002156.SZ |
Listed Date | 8/16/2007 |
Chairman | Shi Mingda. |
CEO | Shi Lei. |
Website | www.tfme.com |
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