Hebei Sinopack Electronic Technology Co.,ltd.
Summary
Revenue :
000,000 M USD
Finance :
000,000 M USD
Earning Cap :
000,000 M USD
Invest :
000,000 M USD
R & D :
0000 People
Growth :
00% AGR
DIGDAL CAP
Overview
| General Introduction | Hebei Zhongci Electronic Technology Co., Ltd. was established in 2009, with a total capital of 1493333333 shares. The company is a high-tech enterprise specializing in the research and development, production, and sales of electronic ceramic series products, committed to becoming a world-class supplier of electronic ceramic products, providing customers with innovative, high-quality, and competitive electronic ceramic products. The company's main products include optical communication device casings, wireless power device casings, infrared detector casings, high-power laser casings, sound meter crystal oscillator type casings, 3D optical sensor module casings, 5G communication terminal module casings, aluminum nitride ceramic substrates, ceramic components, integrated heaters, etc., widely used in fields such as optical communication, wireless communication, industrial lasers, consumer electronics, automotive electronics, etc. The company's electronic ceramic shell products are an important bridge for connecting internal chips and external circuits in high-end semiconductor components, and have a significant impact on the performance of semiconductor components. The company's technological advantages are mainly reflected in new electronic ceramic materials, semiconductor shell simulation design, production processes, and other aspects. In terms of materials, the company independently controls three ceramic systems, including 90% alumina ceramics, 95% alumina ceramics, and aluminum nitride ceramics, as well as corresponding metallization systems. In terms of design, the company has advanced design methods and software platforms, which can optimize the design of ceramic shell structure, wiring, electricity, heat, reliability, etc. The company has been able to design and develop a 400G optical communication device casing, which is equivalent to the technical level of similar foreign products; Equipped with thermodynamic reliability simulation capabilities for sealing ceramic materials such as alumina and aluminum nitride with new metals, meeting the heat dissipation and reliability requirements of the new generation wireless power device casing; Designed to achieve airtightness and high lead strength, the developed high-end fiber coupled semiconductor laser packaging shell meets user requirements. In terms of process technology, the company has a complete set of multi-layer ceramic shell manufacturing technologies, including raw material preparation, casting, punching and punching, metallization printing, lamination, hot cutting, sintering, nickel plating, brazing, gold plating, and other technologies. The company has established a comprehensive processing platform for aluminum oxide ceramics and aluminum nitride ceramics, with aluminum oxide multi-layer ceramic processes mainly based on casting, high-temperature thick film metallization processes mainly based on thick film printing, brazing assembly processes mainly based on high-temperature solder, and nickel and gold plating processes mainly based on electroplating and chemical plating. |
| Headquarter | Shijiazhuang |
| Establish Date | 8/6/2009 |
| Listed Code | 003031.SZ |
| Listed Date | 1/4/2021 |
| Chairman | Bu Aimin. |
| CEO | Fu Hualiang. |
| Website | www.sinopack.com.cn |
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