Beijing YanDong MicroElectronic Co., Ltd.
Summary
Revenue :
000,000 M USD
Finance :
000,000 M USD
Earning Cap :
000,000 M USD
Invest :
000,000 M USD
R & D :
0000 People
Growth :
00% AGR
DIGDAL CAP
Overview
| General Introduction | Beijing Yandong Microelectronics Co., Ltd. is a semiconductor enterprise that integrates chip design, wafer manufacturing, and packaging testing. After more than 30 years of accumulation, the company has developed into a well-known provider of integrated circuit and discrete device manufacturing and system solutions in China. During the reporting period, the company undertook 16 national and provincial level scientific research or technological transformation projects, including one major national science and technology special project, and participated in the formulation of four national standards and one electronic industry standard. It has been awarded the title of "Top 10 Semiconductor Power Device Enterprises in China" for five consecutive years. The company's main business includes two categories: products and solutions, and manufacturing and services. The company's product and solution business focuses on designing, producing, and selling discrete devices, analog integrated circuits, special integrated circuits, and devices; The manufacturing and service business focuses on providing semiconductor open wafer manufacturing and packaging testing services. The company's main market areas include consumer electronics, automotive electronics, new energy, power electronics, communication, intelligent terminals, and special applications. In terms of product and solution business, after years of accumulation, the company has laid out multiple segmented fields and formed a series of products. The company has a complete range of digital transistor products with high accuracy, and an annual shipment volume of over 2 billion units; The company has a full voltage RF process manufacturing platform from 20V to 100V, which can manufacture high-frequency devices that meet different power requirements, including high-frequency transistors, RF VDMOS, and RF LDMOS. The annual shipment volume is over 40 million units; In addition, the company has over 20 years of experience in the design and manufacturing of components in the field of acoustic sensors. It is a major domestic ECM preamplifier shipper with an annual shipment volume of over 2 billion units. Currently, the thinnest product is only 0.3mm thick, which can support customers' requirements for reducing amplifier volume and increasing cavity space; In addition, the company's surge protection devices have a minimum capacitance value of 0.2pF and are widely used in high-speed data transmission ports, with an annual shipment volume of over 5.5 billion units, and have achieved serialization of packaging shapes; In the special field, its subsidiary companies have been deeply involved in this field for decades, with a wide range of products, making it an important supplier of special integrated circuits and devices in China. In terms of manufacturing and service business, as of December 2021, the company has a 6-inch wafer manufacturing capacity of over 60000 pieces/month, and an 8-inch wafer manufacturing capacity of 50000 pieces/month. Both have passed ISO9001, IATF16949 and other system certifications, and have the ability to provide customers with large-scale manufacturing services. The company's 6-inch wafer production line has built process platforms such as planar MOS, planar IGBT, BJT, TVS, JFET, SBD, FRD, and analog IC. The company's 8-inch wafer production line has a manufacturing capacity covering 90nm and above process nodes. It has built process platforms such as groove MOSFET, groove IGBT, CMOS, BCD, MEMS, and is currently developing process platforms such as silicon based optoelectronics, infrared sensors, and RFCMOS. It is an important wafer manufacturing base in China. Taking the construction and operation of the 8-inch line as an opportunity, the company took the lead in achieving the mass production application verification of complete sets of domestic integrated circuit equipment on the 8-inch production line, playing a demonstration and driving role in the large-scale and complete set application of domestic integrated circuit equipment. In order to better meet market demand, the company has launched the construction of a 12 inch integrated circuit production line based on a complete set of domestically produced equipment, with a process node of 65nm. The products include high-density power devices, display driver ICs, power management ICs, silicon optical chips, etc. The construction project has completed relevant procedures such as window guidance from the National Development and Reform Commission, project filing, and environmental impact assessment, and has achieved the purchase and relocation of some equipment. In addition, the company has built a 6-inch SiC wafer production line with a monthly production capacity of 1000 pieces, completed the development of the SiCSBD product process platform, and has started to transition to small-scale trial production. The SiCMOS FET process platform is currently being developed. |
| Headquarter | Beijing |
| Establish Date | 10/6/1987 |
| Listed Code | 688172.SH |
| Listed Date | 12/16/2022 |
| Chairman | Xie Xiaoming. |
| CEO | Huai Yongjin. |
| Website | www.ydme.com |
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