Summary

Revenue : 393.68 M USD
Finance : 485.48 M USD
Earning Cap : 105,408.52 USD / Person
Invest : 0.00 M USD
R & D : 391 People
Growth : 51.16% AGR

DIGDAL CAP

A
Developing Status:
Strategy Pattern:
Developing Pattern:
Strategy Direction:
Aggressive Consertive Stable
Expand Drawback Keep
Investment Organic Default
Barrier Technology Leading Marketing Leading

Overview

General Introduction Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. was established in 2005 and is a semiconductor equipment manufacturer with world leading technology registered in Zhangjiang High tech Park, Pudong New Area, Shanghai. The company integrates research and development, design, manufacturing, and sales, with main products including semiconductor cleaning equipment, semiconductor electroplating equipment, and advanced packaging wet process equipment. The company adheres to the development strategy of differentiated competition and innovation, and provides customized equipment and process solutions to global wafer manufacturing, advanced packaging, and other customers through self-developed single chip megasonic cleaning technology, single chip slot combination cleaning technology, electroplating technology, stress free polishing technology, and vertical furnace tube technology, effectively improving customer production efficiency, improving product yield, and reducing production costs. Shengmei has the qualification of a high-tech enterprise and has undertaken the research and development of the "65-45nm Copper Interconnection Stress Free Polishing Equipment Development Project", a major national science and technology special project during the 11th Five Year Plan period, and the "20-14nm Copper Interconnection Copper Plating Equipment Development and Application" and "45-22 Nanometer Single Chip Wafer Cleaning Equipment Development and Application" national science and technology major special projects during the 12th Five Year Plan period. Based on independent innovation and years of technological research and accumulation, the company has successfully developed the world's first SAPS/TEBO megasonic cleaning technology and Tahoe single chip slot combination cleaning technology, which can be applied to the wafer cleaning field of 28nm and below technology nodes. It can effectively solve the problems of organic contamination and particle cleaning after etching, and significantly reduce the use of concentrated sulfuric acid and other chemical reagents, while helping customers reduce production costs, Meet the requirements of energy conservation and emission reduction. With advanced technology and rich product lines, Shengmei has developed into one of the few semiconductor special equipment suppliers with certain international competitiveness in Chinese Mainland. Its products have been recognized by many mainstream semiconductor manufacturers at home and abroad, and have gained good market reputation.
General Industry Electronics
Concepts Industry Semiconductor concept. ,
Competition Industry
Headquarter Shanghai
Employees 869
Establish Date 5/17/2005
Ownership Foreign Funded Enterprises
Listed Code 688082.SH
Listed Date 11/18/2021
Chairman HUI WANG
CEO Wang Jian.
Website www.acmrcsh.com.cn
Email ir@acmrcsh.com
Phone Call 021-50808868,021-50276506

Product

Undisclosed

R & D

TECHNICIANS: 391 People
PATENTS : 413 PCS
R&D / REVENUE : 17.18%
NATIONAL R&D CENTER : No
NATIONAL STANDARD MAKER : No

Financial

REVENUE : 393.68 M USD
5 years Revenue performance & ARG
NET EARNING : 91.6 M USD
5 years Profits performance & ARG

Product Business Chart

Undisclosed

Financial Investment

INVESTMENT AMOUNT : 0.00 M USD
INVESTMENT CASES : 0
FINANCE : 485.48 M USD
GLOBAL INVEST : No

Historical Investment

Undisclosed

Clients & Competitors

Clients

Undisclosed

Competitors

Undisclosed

Industry Research

Name Category
Electronics General Industry
Semiconductor concept. Concept Industry

Video

Undisclosed

News

Undisclosed

Deep Insights

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